Every semiconductor fabrication facility relies on a precisely controlled supply of wet electronic chemicals to achieve the exacting standards modern chip manufacturing demands. These specialized formulations serve as the foundation for critical processes including wafer cleaning, photoresist development, selective etching, and surface preparation. As device geometries continue shrinking below 5nm, the purity requirements for these chemicals have become increasingly stringent, with metallic impurity specifications now routinely measured in parts per trillion.
At Eata Electronic, we maintain a comprehensive portfolio of wet process chemicals engineered specifically for research and industrial applications. Our product range spans electronic-grade acids, ultra-pure solvents, specialized etchants, and formulated cleaning solutions that support processes from initial substrate preparation through final packaging operations. Each product undergoes rigorous quality verification to ensure batch-to-batch consistency and traceable purity documentation.
Figure 1: Electronic-grade chemicals stored in a controlled cleanroom environment
Chemical Categories Across the Process Flow
Wet electronic chemicals encompass a remarkably diverse array of substances, each tailored to perform specific functions during microfabrication. Rather than treating these materials as commodity inputs, leading fabs recognize that chemical selection directly influences device yield, process repeatability, and ultimately, manufacturing economics.
Acids and Acidic Formulations
Sulfuric acid stands as perhaps the most widely consumed wet chemical in semiconductor fabrication, typically deployed in combination with hydrogen peroxide in the iconic Piranha solution for removing organic residues and photoresist remnants. Hydrofluoric acid enables precise silicon dioxide removal, while hydrochloric acid paired with peroxide forms SC-2 mixtures targeting metallic contamination. Phosphoric acid offers selective etching of silicon nitride layers, and nitric acid provides strong oxidizing capability for surface treatments. We supply each of these acids at purity levels ranging from standard electronic grade through G5 specifications with sub-ppt metallic contamination profiles.
Alkaline Solutions
Ammonium hydroxide serves as the cornerstone of RCA Standard Clean 1 formulations, where its mildly alkaline nature lifts particles from wafer surfaces through controlled silicon etching. When combined with hydrogen peroxide, this mixture effectively strips organic contaminants while minimizing substrate damage. Potassium hydroxide finds application in silicon anisotropic etching processes, particularly for MEMS device fabrication. Sodium hydroxide solutions provide economical alternatives for less critical cleaning operations. Our alkaline products are characterized by exceptionally low particle counts and carefully controlled metal ion specifications.
Figure 2: Semiconductor wafer undergoing precision wet chemical etching
Electronic-Grade Solvents
The solvent category represents one of the broadest segments within wet electronic chemicals, spanning alcohols, ketones, esters, glycols, and specialized aprotic solvents. Isopropyl alcohol dominates as a post-cleaning rinse agent and drying aid, valued for its excellent water miscibility and residue-free evaporation. Acetone provides aggressive cleaning capability for removing stubborn organic films. N-Methyl-2-pyrrolidone (NMP) and dimethyl sulfoxide (DMSO) excel as photoresist strippers, particularly for hardened or heavily cross-linked resists. Propylene glycol methyl ether acetate (PGMEA) functions as the primary thinner and edge bead removal solvent for advanced photoresist formulations. Our solvent portfolio addresses applications from basic substrate cleaning through specialized lithographic processing.
Formulated Etchants
Pre-mixed etching solutions offer manufacturers significant advantages in process consistency and handling simplicity. Buffered oxide etchants (BOE), combining hydrofluoric acid with ammonium fluoride, provide precisely controlled silicon dioxide removal rates essential for gate oxide thinning and contact hole formation. Metal etchants targeting aluminum, copper, gold, chromium, and nickel enable interconnect patterning with exceptional selectivity. ITO etchants support transparent conductive electrode fabrication for display applications. Each formulated product is shipped with detailed specifications including etch rate data, selectivity ratios, and recommended operating conditions.
Figure 3: Advanced fluoropolymer chemical delivery manifold for process distribution
Applications and Corresponding Chemical Solutions
The table below maps key wet chemical applications to the corresponding product categories available from our portfolio. This overview helps process engineers quickly identify relevant materials for their specific manufacturing steps.
| Application |
Relevant Chemical Categories |
| Wafer Cleaning |
Sulfuric acid, Ammonium hydroxide, Hydrochloric acid, Hydrogen peroxide, Isopropyl alcohol |
| Photoresist Stripping |
NMP, DMSO, Monoethanolamine, Sulfuric acid / Hydrogen peroxide mixtures |
| Oxide Etching |
Hydrofluoric acid, Buffered oxide etchant (BOE), Ammonium fluoride |
| Metal Etching |
Phosphoric acid / Nitric acid / Acetic acid blends, Copper etchants, Aluminum etchants |
| Photoresist Development |
TMAH-based developers, Sodium hydroxide developers, KOH developers |
| Photoresist Thinning |
PGMEA, Ethyl lactate, Propylene glycol monomethyl ether |
| RCA Standard Clean |
Ammonium hydroxide, Hydrochloric acid, Hydrogen peroxide (SEMICONDUCTOR grade) |
| Surface Preparation |
Piranha solution components, SC-1, SC-2, SPM (Sulfuric peroxide mixture) |
| Post-Etch Residue Removal |
Hydroxylamine-based formulations, Fluorinated organic solvents |
| Substrate Drying |
Isopropyl alcohol, Methanol, Dehydration agents |
Figure 4: Assortment of high-purity wet electronic chemicals in laboratory vessels
Purity Grades and Specifications
Electronic wet chemicals are classified according to purity hierarchies established by SEMI (Semiconductor Equipment and Materials International). These grades, typically designated G1 through G5, define progressively tighter limits on metallic impurities, particle counts, and moisture content. The selection of appropriate grade depends directly on the device technology node being manufactured.
| Grade |
Typical Application |
Impurity Specification |
| G1 |
Photovoltaic / LED |
Metal impurities <= 1 ppm, suitable for less critical wet processes |
| G2 |
Discrete devices / FPD |
Metal impurities <= 10 ppb, particles <= 25 pcs/mL above 0.5 micron |
| G3 |
IC (>= 0.8 micron) |
Metal impurities <= 1 ppb, tighter particle control for mainstream logic |
| G4 |
IC (0.2-0.8 micron) |
Metal impurities <= 0.1 ppb, ppt-level analysis required |
| G5 |
Advanced IC (< 0.2 micron) |
Metal impurities <= 0.01 ppb (10 ppt), maximum purity available |
Our inventory includes products spanning G1 through G5 specifications, enabling us to support customers across the full spectrum from research and development through high-volume production of the most advanced logic and memory devices. Certificate of analysis documentation accompanies each shipment, providing batch-specific verification of critical quality parameters.
Representative Product Selection
The following selection illustrates the breadth of our wet electronic chemicals portfolio. We encourage direct inquiry for products not explicitly listed, as our catalog expands continuously to address emerging process requirements.
| Product Name |
CAS Number |
Primary Application |
| Acetic Acid, Electronic Grade |
64-19-7 |
Photoresist developer component, pH adjustment |
| Acetone, Electronic Grade |
67-64-1 |
Degreasing, photoresist stripping, general cleaning |
| Ammonium Fluoride Solution |
12125-01-8 |
Buffered oxide etchant component |
| Ammonium Hydroxide, SEMI Grade |
1336-21-6 |
RCA SC-1 cleaning, particle removal |
| Buffered Oxide Etchant (BOE) |
Mixture |
Controlled SiO2 etching, oxide thinning |
| Hydrochloric Acid, Electronic Grade |
7647-01-0 |
RCA SC-2 cleaning, metallic contamination removal |
| Hydrofluoric Acid, Electronic Grade |
7664-39-3 |
Silicon dioxide etching, surface treatment |
| Hydrogen Peroxide, Semiconductor Grade |
7722-84-1 |
Piranha / SPM mixtures, organic removal |
| Isopropyl Alcohol (IPA), Electronic Grade |
67-63-0 |
Post-clean rinse, wafer drying aid |
| N-Methyl-2-pyrrolidone (NMP), Electronic Grade |
872-50-4 |
Photoresist stripping, flux removal |
| Nitric Acid, Electronic Grade |
7697-37-2 |
Surface oxidation, metal etching component |
| Phosphoric Acid, Electronic Grade |
7664-38-2 |
Silicon nitride etching, metal polishing |
| Propylene Glycol Methyl Ether Acetate (PGMEA) |
108-65-6 |
Photoresist thinner, edge bead removal |
| Sulfuric Acid, Electronic Grade |
7664-93-9 |
Piranha cleaning, organic stripping |
| Tetramethylammonium Hydroxide (TMAH) |
75-59-2 |
Positive photoresist developer |
Figure 5: Multi-stage purification and filtration system for electronic-grade chemical production
Custom Formulation and Tailored Solutions
Beyond our standard catalog offerings, Eata Electronic welcomes inquiries for custom-formulated wet chemical products. Many advanced processes demand specific blend ratios, particular additive packages, or unconventional purity profiles that fall outside typical commercial specifications. Our technical team collaborates closely with customers to develop tailored solutions that address unique process challenges.
Customization capabilities encompass adjusted mixture ratios for multi-component etchants, specialized packaging in fluoropolymer containers for extended shelf life, custom particle filtration specifications, and modified purity grades targeting specific contamination-sensitive applications. We also accommodate private labeling arrangements and customer-specific documentation requirements.
To discuss your particular wet chemical requirements, including products not listed in this overview, please contact our applications team with details of your intended process and specification targets.
For Research or Industrial Raw Materials, Not For Personal Medical Use!