Sputtering Targets

Eata Electronic storage-grade oxide sputtering targets overcome the density limitation of conventional hot-pressed targets, reaching over 99.9% relative density with minimal internal porosity and exceptional grain size uniformity. Through the vacuum hot isostatic pressing forming process, we suppress arcing and particle generation issues during high-power sputtering.

These high-performance targets are extensively used for depositing functional layers of ReRAM, phase-change memory, and ferroelectric memory in semiconductor fabs. We provide customized bonding services to adapt to your existing sputtering equipment. Explore our sputtering targets portfolio to find the optimal specification for your production line.

Eata Electronic offers a complete range of oxide sputtering targets with full pre-delivery performance validation. Each product passes rigorous tests for density, purity, and bonding strength to ensure long-term stable operation in high-vacuum sputtering systems. Whether you need mass-produced standard targets for continuous wafer processing or special-shaped custom targets for R&D equipment, our engineering team will customize the most cost-effective supply plan. Get in touch with us today to discuss your specific sputtering process requirements.

Catalog Number	Product Name	Order	Quantity
OMM-QCY-0008	Silicon Monoxide Sputtering Target	Inquiry	- +
OMM-QCY-0009	Selenium Oxide Sputtering Target	Inquiry	- +
OMM-QCY-0010	Gadolinium Cerium Oxide Sputtering Target	Inquiry	- +
OMM-QCY-0011	Gadolinium Oxide Sputtering Target	Inquiry	- +
OMM-QCY-0012	Yttrium Aluminum Oxide Sputtering Target	Inquiry	- +
OMM-QCY-0013	Yttrium Oxide Sputtering Target	Inquiry	- +
OMM-QCY-0014	Ruthenium Oxide Sputtering Target	Inquiry	- +
OMM-QCY-0015	Samarium Cerium Oxide Sputtering Target	Inquiry	- +
OMM-QCY-0016	Samarium Copper Oxide Sputtering Target	Inquiry	- +
OMM-QCY-0017	Samarium Nickel Oxide Sputtering Target	Inquiry	- +

For Research or Industrial Raw Materials, Not For Personal Medical Use!