Cat No:ECCC-0008
Post-copper etch cleaning solution is designed for the removal of etch residues in copper interconnect damascene processes of integrated circuits. This cleaning solution provides excellent etch residue removal capability with low defectivity and cost-effective performance. The product has been qualified for multiple logic chip technology nodes, 3D NAND and DRAM memory chips, CIS specialty processes, and 2.5D/3D packaging processes, and is in mass production.
| Primary Applications | • Copper interconnect damascene etch residue removal • Logic chip multiple technology nodes • 3D NAND and DRAM memory chips • CIS specialty processes • 2.5D and 3D packaging processes |
| Product Type | Cleaning Solution / Post-Etch Cleaner |
| Application Nodes | Multiple logic nodes, 3D NAND, DRAM, CIS, 2.5D/3D |
| Manufacturing Process | Copper damascene etch process cleaning |
| Key Benefits | • Excellent etch residue removal capability • Low defectivity performance • Cost-effective solution • Broad application across multiple process types |
Eata Electronic is your trusted partner for premium electronic materials, tailored solution frameworks and end-to-end supply chain support—fueling your innovation progress, every step of the way
For Research or Industrial Raw Materials, Not For Personal Medical Use!
|
There is no product in your cart. |
Eata Electronic supplies high-performance electronic materials spanning semiconductors, ceramics, polymers, superconductors, magnetic materials, specialty gases, and advanced alloys—delivering precision-engineered solutions for global technology leaders in chip manufacturing, quantum computing, renewable energy, and next-generation electronics. .
Enter your E-mail and receive the latest news from us.
Copyright © Eata Electronic. All rights reserved.
