Encapsulation materials

Encapsulation polymers from Eata Electronic are precision-formulated protective materials built to shield sensitive electronic components from thermal stress, moisture, shock, and contamination. With low CTE, strong adhesion, and superior thermal cycling resistance, they ensure long-term reliability in semiconductor packaging, power modules, and optoelectronic devices.

Designed for automotive electronics, 5G communications, and industrial systems, these materials maintain consistent protective performance under extreme temperatures and harsh operating conditions.

Explore our encapsulation material selection below to find the right solution for your packaging and protection needs.

Eata Electronic offers a complete lineup of premium encapsulation polymer materials, from standard grades to custom-developed formulations, engineered to protect sensitive components across a wide range of electronic systems. Backed by rigorous quality management and hands-on technical support, we deliver dependable encapsulation solutions that boost device reliability and extend operational life. If our products and services align with your needs, please contact us for further details.

Catalog Number	Product Name	Order	Quantity
EPMEM-0031	Polyetheramine/Cycloaliphatic Amine Hybrid Encapsulant, 305 mgKOH/g	Inquiry	- +
EPMEM-0032	Polyetheramine/Cycloaliphatic Amine Hybrid Encapsulant, 300 mgKOH/g	Inquiry	- +
EPMEM-0033	Polyetheramine/Cycloaliphatic Amine Hybrid Encapsulant, 340 mgKOH/g, Viscosity 80-200	Inquiry	- +
EPMEM-0034	Polyetheramine/Cycloaliphatic Amine Hybrid Encapsulant, 280 mgKOH/g, Viscosity 20-80	Inquiry	- +
EPMEM-0035	Polyetheramine/Cycloaliphatic Amine Hybrid Encapsulant, 293 mgKOH/g	Inquiry	- +
EPMEM-0036	Polyetheramine/Cycloaliphatic Amine Hybrid Encapsulant, 275 mgKOH/g	Inquiry	- +
EPMEM-0037	Polyetheramine/Cycloaliphatic Amine Hybrid Encapsulant, 468 mgKOH/g	Inquiry	- +

For Research or Industrial Raw Materials, Not For Personal Medical Use!